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超微主板 X11SPI-TF 支持3647 志强第一代CPU

超微主板 X11SPI-TF 支持3647 志强第一代CPU

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Key Features

  1. 2nd Gen Intel Xeon Scalable Processors and Intel Xeon Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP

  2. Intel C622

  3. Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots


    • Expansion slots:

    • 1 PCIe 3.0 x16,

    • 1 PCIe 3.0 x16 (x16 || x8),

    • 1 PCIe 3.0 x8 (x0 || x8),

    • 1 PCIe 3.0 x8,

    • 1 PCIe 3.0 x4 (in x8)


    • M.2 NGFF connector

    • M.2 Interface: PCIe 3.0 x4 and SATA

    • Form Factor: 2280, 22110

    • Key: M-Key

  6. 2 10GbE LAN ports

  7. 10 SATA3 (6Gbps) via C622

  8. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)

  9. I/O: 1 VGA, 2 COM, TPM header

Product SKUs
MBD-X11SPI-TF
Physical Stats
Form Factor

  • ATX

Dimension

  • 12" x 9.6" (30.48cm x 24.38cm)

Processor
CPU

  • 2nd Gen Intel Xeon Scalable Processors and Intel Xeon Scalable Processors

  • Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP

Core

  • Up to 28 cores

Note

  • BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP
    BIOS version 3.2 or above is required to support 2nd Gen Intel Xeon Scalable processors (codenamed Cascade Lake-R)

System Memory
Memory Capacity

  • 8 DIMM slots

  • Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz

Memory Type

  • 2933/2666/2400/2133 MT/s ECC DDR4 LRDIMM (3DS), RDIMM (3DS)

DIMM Sizes

  • LRDIMM: 32GB, 64GB, 128GB

  • RDIMM: 8GB, 16GB, 32GB, 64GB

Memory Voltage

  • 1.2V

Error Detection

  • Corrects single-bit errors

On-Board Devices
Chipset

  • Intel C622

SATA

  • Intel C622 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10

IPMI

  • ASPEED AST2500

Graphics

  • 1 ASPEED AST2500 BMC port(s)

Network Controllers 0
0

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