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超微主板 X13DEM 支持第四代至强可扩展 LGA4677

超微主板 X13DEM 支持第四代至强可扩展 LGA4677

Key Features

4th Gen Intel Xeon Scalable processors, Dual Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Support HBM and CXL
Intel C741? Chipset
Up to 8TB 3DS ECC RDIMM, DDR5-4800MHz in 32 DIMM slots
4 PCIe 5.0 x16
2 AIOM OCP 3.0 superset
8 NVMe ports PCIe 5.0 x8 via 8 MCIO connectors
1 USB 2.0 and 1 USB 3.0
2 M.2
1 VGA

Product SKUs
MBD-X13DEM

Physical Stats
Form Factor	Proprietary
Dimension	11.5" x 17" (29.21cm x 43.18cm)

Processor
CPU	4th Gen Intel Xeon Scalable processors Dual Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
Core	Up to 60 cores

System Memory
Memory Capacity	32 DIMM slots Up to 8TB 3DS ECC RDIMM, DDR5-4800MHz
Memory Type	4800/4400/4000 MT/s ECC DDR5 RDIMM (3DS) Up to 256GB of memory with speeds of up to 4400MT/s (2DPC)
DIMM Sizes	16GB, 32GB, 64GB, 128GB, 256GB RDIMM: 16GB, 32GB, 64GB, 128GB, 256GB
Memory Voltage	1.1V
Error Detection	Corrects single-bit errors Detects double-bit errors (using ECC memory)

On-Board Devices
Chipset	Intel C741
SATA	Intel C741 controller for 8 SATA3 ports
Network Controllers	N/A

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