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超微主板 H13SST-GC 支持AMD SP3 CPU

超微主板 H13SST-GC 支持AMD SP3 CPU

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Key Features

  1. AMD EPYC 9004 series Processors

  2. System on Chip

  3. Up to 3TB 3DS ECC RDIMM, DDR5-4800MHz in 12 DIMM slots

  4. LSI 3808 controller for 6 SAS3 ports

  5. AMD FCH controller for 8 SATA3 (6 Gbps) ports;

  6. 1x PCIe 4.0 x8 4C connector (for front I/O module), 5x PCIe 5.0 x8 MCIO connectors

  7. M.2 Interface: 2 SATA/PCIe 4.0 x4, M.2 Form Factor: 2280

Product SKUs
MBD-H13SST-GC
Physical Stats
Form Factor

  • Proprietary GrandTwin

Dimension

  • 8.53" x 12.42" (21.67cm x 31.55cm)

Processor
CPU

  • AMD EPYC 9004 series Processors

  • Single Socket SP5 supported, CPU TDP supports Up to 400W TDP

Core

  • Up to 96/192

System Memory
Memory Capacity

  • 12 DIMM slots

  • Up to 3TB 3DS ECC Registered RDIMM, DDR5-4800MHz

Memory Type

  • 4800 MT/s ECC DDR5 RDIMM (3DS) Up to 256GB of memory with speeds of up to 4800MHz (1DPC)

DIMM Sizes

  • 16GB, 24GB, 32GB, 40GB, 48GB, 64GB, 80GB, 96GB, 128GB, 192GB, 256GB

Memory Voltage

  • 1.1V

Error Detection

  • Corrects single-bit errors

  • Detects double-bit errors (using ECC memory)

On-Board Devices
Chipset

  • System on Chip

SAS

  • Broadcom 3808 SAS3 (12 Gbps) controller for 8 SAS3 (12 Gbps) ports

IPMI

  • ASPEED AST2600 BMC

Graphics

  • 1 Aspeed AST2600 BMC port(s)

Network Controllers

  • N/A

Input / Output
TPM

  • 1 TPM header

Other

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0

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